Interlayer dielectric material in a semiconductor device comprising stressed layers with an intermediate buffer material

ABSTRACT

A highly stressed dielectric material, such as a tensile stressed material, may be deposited in a conformal manner so as to respect any deposition constraints caused by pronounced surface topography of highly scaled semiconductor devices, followed by the deposition of a buffer material having enhanced gap-filling capabilities. Thereafter, a further stress-inducing layer is deposited to form a doublet structure, which acts on the transistor elements, thereby enhancing overall performance, without increasing the probability of creating deposition-related irregularities. Hence, production yield as well as performance of highly scaled semiconductor devices may be increased.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Generally, the present disclosure relates to the field of integratedcircuits, and, more particularly, to field effect transistors andmanufacturing techniques on the basis of stressed dielectric layersformed above the transistors used for generating strain in channelregions of the transistors.

2. Description of the Related Art

Integrated circuits are typically comprised of a large number of circuitelements located on a given chip area according to a specified circuitlayout, wherein, in complex circuits, the field effect transistorrepresents one predominant circuit element. Generally, a plurality ofprocess technologies are currently practiced, wherein, for complexcircuitry based on field effect transistors, such as microprocessors,storage chips and the like, CMOS technology is currently one of the mostpromising approaches due to the superior characteristics in view ofoperating speed and/or power consumption and/or cost efficiency. Duringthe fabrication of complex integrated circuits using CMOS technology,millions of complementary transistors, i.e., N-channel transistors andP-channel transistors, are formed on a substrate including a crystallinesemiconductor layer. A field effect transistor, irrespective of whetheran N-channel transistor or a P-channel transistor is considered,comprises so-called PN junctions that are formed by an interface ofhighly doped drain and source regions with an inversely or weakly dopedchannel region disposed between the drain region and the source region.

The conductivity of the channel region, i.e., the drive currentcapability of the conductive channel, is controlled by a gate electrodeformed above the channel region and separated therefrom by a thininsulating layer. The conductivity of the channel region, upon formationof a conductive channel due to the application of an appropriate controlvoltage to the gate electrode, depends on the dopant concentration, themobility of the majority charge carriers and, for a given extension ofthe channel region in the transistor width direction, on the distancebetween the source and drain regions, which is also referred to aschannel length. Hence, in combination with the capability of rapidlycreating a conductive channel below the insulating layer uponapplication of the control voltage to the gate electrode, theconductivity of the channel region substantially determines theperformance of the MOS transistors. Thus, the reduction of the channellength, and associated therewith the reduction of the channelresistivity, may be a dominant design criterion for accomplishing anincrease in the operating speed of the integrated circuits.

The shrinkage of the transistor dimensions, however, involves aplurality of issues associated therewith that have to be addressed so asto not unduly offset the advantages obtained by steadily decreasing thechannel length of MOS transistors. One issue associated with reducedgate lengths is the occurrence of so-called short channel effects, whichmay result in a reduced controllability of the channel conductivity.Short channel effects may be countered by certain design techniques,some of which, however, may be accompanied by a reduction of the channelconductivity, thereby partially offsetting the advantages obtained bythe reduction of critical dimensions.

In view of this situation, it has been proposed to enhance deviceperformance of the transistor elements not only by reducing thetransistor dimensions but also by increasing the charge carrier mobilityin the channel region for a given channel length, thereby increasing thedrive current capability and thus transistor performance. For example,the lattice structure in the channel region may be modified, forinstance, by creating tensile or compressive strain therein, whichresults in a modified mobility for electrons and holes, respectively.For example, creating tensile strain in the channel region of a siliconlayer having a standard crystallographic configuration may increase themobility of electrons, which in turn may directly translate into acorresponding increase of the conductivity of N-type transistors. On theother hand, compressive strain in the channel region may increase themobility of holes, thereby providing the potential for enhancing theperformance of P-type transistors.

One efficient approach in this respect is a technique that enables thecreation of desired stress conditions within the channel region ofdifferent transistor elements by adjusting ing the stresscharacteristics of a dielectric layer stack that is formed above thebasic transistor structure. The dielectric layer stack typicallycomprises one or more dielectric layers which may be located close tothe transistor and which may also be used in controlling a respectiveetch process in order to form contact openings to the gate and drain andsource terminals. Therefore, an effective control of mechanical stressin the channel regions, i.e., effective stress engineering, may beaccomplished by individually adjusting the internal stress of theselayers, which may also be referred to as contact etch stop layers, andby positioning a contact etch stop layer having an internal compressivestress above a P-channel transistor while positioning a contact etchstop layer having an internal tensile strain above an N-channeltransistor, thereby creating compressive and tensile strain,respectively, in the respective channel regions.

Typically, the contact etch stop layer is formed by plasma enhancedchemical vapor deposition (PECVD) processes above the transistor, i.e.,above the gate structure and the drain and source regions, wherein, forinstance, silicon nitride may be used due to its high etch selectivitywith respect to silicon dioxide, which is a well-established interlayerdielectric material. Furthermore, PECVD silicon nitride may be depositedwith a high intrinsic stress, for example, up to 2 Giga Pascal (GPa) orsignificantly higher of compressive stress and up to 1 GPa andsignificantly higher of tensile stress, wherein the type and themagnitude of the intrinsic stress may be efficiently adjusted byselecting appropriate deposition parameters. For example, ionbombardment, deposition pressure, substrate temperature, gas flow ratesand the like represent respective parameters that may be used forobtaining the desired intrinsic stress.

During the formation of the two types of stressed layers, conventionaltechniques may suffer from reduced efficiency and increased yield losswhen device dimensions are increasingly scaled by using the 90 nmtechnology and even further advanced approaches, due to the limitedconformal deposition capabilities of the deposition process involved,which may result in respective process non-uniformities duringsubsequent process steps for patterning the stressed layer and formingcontact openings, as will be explained in more detail with reference toFIGS. 1 a-1 b.

FIG. 1 a schematically illustrates a cross-sectional view of asemiconductor device 100 in a certain manufacturing stage for formingstress-inducing layers above a first device area 120A and a seconddevice area 120B. The first and second device areas 120A, 120B, whichtypically represent respective transistor elements, may be formed abovea substrate 101 comprising a semiconductor layer 102, such as asilicon-based layer, which may be separated from the substrate 101 by anappropriate buried insulating layer if a silicon-on-insulator (SOI)configuration is considered. In the example shown, the first and seconddevice areas 120A, 120B may comprise a plurality of transistor elementswith a lateral distance according to the design rules of the technologyunder consideration. The transistors in the first and second deviceareas 120A, 120B may comprise a gate electrode 121 formed on arespective gate insulation layer, which separates the gate electrode 121from a corresponding channel region 124, which is laterally locatedbetween respective drain/source regions 125. Furthermore, a sidewallspacer structure 122 may be formed on sidewalls of the gate electrode121. Typically, metal silicide regions (not shown) may be provided inthe drain and source regions 125 and the gate electrodes 121 in order toenhance the conductivity of these areas. The semiconductor device 100may represent an advanced device in which critical dimensions, such asthe gate length, i.e., in FIG. 1 a, the horizontal extension of the gateelectrodes 121, may be approximately 50 nm or significantly less.Consequently, a distance between respective transistor elements, i.e.,the lateral distance between neighboring sidewall spacer structures 122of closely spaced transistor elements, may be approximately 100 nm oreven less, wherein, depending on the device configuration, in densedevice areas, a plurality of closely spaced circuit elements may beprovided.

It should be appreciated that the first and second device regions 120A,120B may be separated by an appropriate isolation structure (not shown)if required. Furthermore, in the manufacturing stage shown in FIG. 1 a,a silicon nitride layer 130 comprising a high intrinsic stress may beformed above the first and second device areas 120A, 120B followed by anetch indicator layer 131 comprised of silicon dioxide. It should beappreciated that, if required, an etch stop layer, such as a silicondioxide layer of appropriate thickness and density, may be providedbetween the silicon nitride layer 130 and the respective transistorelements in the first and second device areas 120A, 120B.

As is evident from FIG. 1 a, due to the reduced spacing betweenneighboring transistor elements, the silicon nitride layer 130 maydefine a respective surface topography in which tapered recesses, alsoreferred to as seams 132, may be formed between the closely spacedtransistor elements, since the spacing between the transistor elementsmay be in the order of two times a layer thickness of the siliconnitride layer 130, which, in combination with the limited conformal fillbehavior, may even result in corresponding defects, such as voids 132Aand the like.

Furthermore, in this manufacturing stage, the semiconductor device 100may comprise a resist mask 103 exposing the first device area 120A whilecovering the second device region 120B. In this case, it may be assumedthat the intrinsic stress of the silicon nitride layer 130 may beappropriately selected so as to enhance the transistor performance inthe second device area 120B, which may, for instance, include N-channeltransistors requiring a high tensile stress in the layer 130.

A typical process flow for forming the semiconductor device 100 as shownin FIG. 1 a may comprise the following processes. The gate electrodes121 and the gate insulation layers may be formed and patterned on thebasis of well-established process techniques including advancedphotolithography, deposition, oxidation and etch techniques. Thereafter,the drain and source regions 125 may be formed in combination with thesidewall spacer structures 122 on the basis of well-establisheddeposition processes, anisotropic etch processes and implantationsequences in order to establish the desired vertical and lateral dopantprofile. Thereafter, respective silicide regions may be formed, ifrequired, on the basis of well-established techniques. Next, ifrequired, a corresponding silicon dioxide etch stop layer may be formedfollowed by the deposition of the silicon nitride layer 130. During thedeposition of the silicon nitride material, respective processparameters, such as composition of carrier gases and reactive gases,substrate temperature, deposition pressure and, in particular, ionbombardment during the deposition, may significantly influence thefinally obtained intrinsic stress of the material as deposited withrespect to the underlying materials. For example, when the layer 130 isdeposited with high tensile stress of up to 1 GPa or even significantlyhigher, the ion bombardment is reduced, for instance, by establishingthe deposition atmosphere with a low level of radio frequency (RF) powerso as to obtain the desired tensile property of the material asdeposited. However, the moderately low RF power may result in reducedsurface diffusion of the reactive species in the deposition ambient,thereby compromising conformality. Due to the less pronouncedconformality of the silicon nitride deposition process above a certainlayer thickness and for increased aspect ratios, as may occur in highlyscaled devices, caused by the reduced distance between the neighboringtransistor elements at moderately dimensioned gate heights in denselypacked device areas, as shown, the silicon nitride material may merge inthe lateral growth direction between closely spaced transistor elements,thereby forming the respective seam 132, or respective overhangs mayform, thereby resulting in the void 132A. Thus, in the subsequentdeposition of the silicon dioxide layer 131, the local depositionconditions at the seam 132 may result in a non-uniformity of the layerthickness, thereby giving rise to respective etch non-uniformities in acontact etch process to be performed in a later stage.

After the deposition of the silicon dioxide layer 131, the resist mask103 may be formed on the basis of well-established photolithographytechniques. Next, an appropriately designed etch process may beperformed in order to remove a portion of the layers 130 and 131 fromthe first device area 120A. During the corresponding etch process, thesilicon dioxide material of the layer 131 may be removed first followedby a selective etch process for removing the material of the siliconnitride layer 130, wherein the corresponding etch process may becontrolled on the basis of an etch stop layer, if required. Due to thesignificantly increased layer thickness of the silicon dioxide layer 131at the seam 132, the material may not be completely removed during theetch process when removing the layer 131, thereby significantly blockingthe selective etch chemistry during the subsequent etch process forremoving the exposed portion of the silicon nitride layer 130.

Consequently, respective material residuals may remain between thetransistors in the first device area 120A, which may result inrespective non-uniformities during the further processing, for instance,during the deposition of a further dielectric layer of high intrinsicstress designed to enhance the transistor performance of the transistorsin the first device area 120A.

FIG. 1 b schematically illustrates the semiconductor device 100 at afurther advanced manufacturing stage. As shown, a second dielectriclayer 140, for instance having a compressive stress, may be formed abovethe first and second device areas 120A, 120B. Consequently, due to thematerial residual 132 previously produced during the removal of thetensile layer 130, the respective stress transfer mechanism may bedeteriorated, while additionally the residual 132 may provide respectiveetch non-uniformities in the subsequent patterning sequence for formingrespective contact openings. Similarly, the void 132A in the seconddevice region 120B may also result in a reduced stress transfermechanism, as well as degraded etch uniformity during the subsequentprocessing.

As a consequence, upon further device scaling, the respective limitationof deposition processes for dielectric materials of high intrinsicstress, in particular for tensile-stressed silicon nitride, may requirea significant reduction of the layer thickness to comply with increasedaspect ratios encountered in advanced device geometries. However, inthis case, the respective strain induced by the stressed dielectricmaterials may also be significantly reduced, thereby also reducingtransistor performance, in particular performance of N-channeltransistors.

The present disclosure is directed to various methods and devices thatmay avoid, or at least reduce, the effects of one or more of theproblems identified above.

SUMMARY OF THE INVENTION

The following presents a simplified summary of the invention in order toprovide a basic understanding of some aspects of the invention. Thissummary is not an exhaustive overview of the invention. It is notintended to identify key or critical elements of the invention or todelineate the scope of the invention. Its sole purpose is to presentsome concepts in a simplified form as a prelude to the more detaileddescription that is discussed later.

Generally, the subject matter disclosed herein addresses the problem ofreduced efficiency of strain-inducing mechanisms in sophisticatedtransistor elements and/or of respective non-uniformities during thepatterning of contact openings by providing a technique in which asubstantially conformal deposition behavior is used by appropriatelyselecting the thickness of the highly stressed material, therebysignificantly reducing the probability of creating voids or seems duringthe deposition of the highly stressed dielectric material. Moreover, thepronounced surface topography of the resulting structure may be reducedby the deposition of a buffer material, which may be formed with asignificantly reduced internal stress level compared to the actualstress-inducing materials, thereby enabling enhanced flexibility inselecting appropriate deposition techniques and parameters to provideincreased gap-filling capabilities of the deposition technique.Consequently, by providing the buffer material, the previously createdsurface topography may be significantly relaxed and may thereforeprovide a surface geometry that enables a further, less criticaldeposition of a highly stressed dielectric material. In this way, a“doublet” of highly stressed dielectric material layers with anintermediate buffer material may be provided, which therefore results inan overall increase of the stressed dielectric material in the vicinityof the respective transistor elements while nevertheless reducing theprobability of creating non-uniformities during the further processing.Consequently, upon further device scaling, thereby reducing the distancebetween neighboring gate electrode structures in densely packed deviceregions, the gap-filling capabilities of the respective depositionprocess may be taken into consideration by forming the two highlystressed dielectric layers in a highly conformal manner, whilenevertheless providing an overall increase of the amount of stresseddielectric material that may be positioned in the vicinity of thetransistor of interest. For example, the significant restriction for atensile stressed dielectric material formed on the basis of PECVDsilicon nitride may be relaxed by the doublet stress layer approach,which may result in a significant performance gain for N-channeltransistors, even for technology standards corresponding to the 65 nmnode and beyond.

One illustrative method disclosed herein comprises conformally forming afirst stress-inducing layer above a plurality of transistors that areformed above a substrate, wherein the first stress-inducing layergenerates a first type of stress. The method further comprises forming afirst dielectric layer above the first stress-inducing layer, whereinthe first dielectric layer has an internal stress level that is lessthan a stress level of the first stress-inducing layer. Moreover, asecond stress-inducing layer is formed above the first dielectric layerand induces the first type of stress. Finally, the method comprisesforming a second dielectric layer above the second stress-inducinglayer.

A further illustrative method disclosed herein comprises forming a firststress-inducing dielectric layer above a plurality of transistors in asubstantially conformal manner by using a first deposition technique.The method additionally comprises forming a buffer material above thefirst stress-inducing layer by using a second deposition techniquehaving an increased gap-filling capability compared to the firstdeposition technique. The method further comprises forming a secondstress-inducing dielectric layer above the buffer material, wherein thefirst and second stress-inducing layers produce the same type of stress.Finally, the method comprises forming a dielectric material above thesecond stress-inducing dielectric layer to form an interlayer dielectricstack.

One illustrative semiconductor device disclosed herein comprises aninterlayer dielectric layer stack formed above a plurality oftransistors. The interlayer dielectric layer stack comprises a firststress-inducing layer located next to the plurality of transistors, abuffer material formed above the first stress-inducing layer and asecond stress-inducing layer that is formed above the buffer material.Furthermore, the layer stack comprises a final dielectric material,wherein, in the interlayer dielectric layer stack, the first and secondstress-inducing layers induce the same type of stress.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be understood by reference to the followingdescription taken in conjunction with the accompanying drawings, inwhich like reference numerals identify like elements, and in which:

FIGS. 1 a-1 b schematically illustrate cross-sectional views of asemiconductor device during various manufacturing stages in formingdifferently stressed contact etch stop layers, wherein the semiconductordevice includes closely spaced transistor elements, according toconventional techniques;

FIGS. 2 a-2 g schematically illustrate cross-sectional views of asemiconductor device including a plurality of densely packed transistorelements in various manufacturing stages for forming a highly stresseddielectric material, such as a tensile stressed dielectric material, ina “doublet” configuration with an intermediate buffer material,according to illustrative embodiments;

FIGS. 3 a-3 b schematically illustrate cross-sectional views of asemiconductor device including transistor elements of different type,above which are formed stressed dielectric materials of different typeof internal stress, wherein a doublet configuration is provided aboveN-channel transistors for enhancing transistor performance thereof,according to further illustrative embodiments; and

FIGS. 4 a-4 b schematically illustrate cross-sectional views of asemiconductor device during various manufacturing stages, whereindifferent types of transistors receive a doublet configuration,according to still other illustrative embodiments.

While the subject matter disclosed herein is susceptible to variousmodifications and alternative forms, specific embodiments thereof havebeen shown by way of example in the drawings and are herein described indetail. It should be understood, however, that the description herein ofspecific embodiments is not intended to limit the invention to theparticular forms disclosed, but on the contrary, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the invention as defined by the appended claims.

DETAILED DESCRIPTION

Various illustrative embodiments of the invention are described below.In the interest of clarity, not all features of an actual implementationare described in this specification. It will of course be appreciatedthat in the development of any such actual embodiment, numerousimplementation-specific decisions must be made to achieve thedevelopers' specific goals, such as compliance with system-related andbusiness-related constraints, which will vary from one implementation toanother. Moreover, it will be appreciated that such a development effortmight be complex and time-consuming, but would nevertheless be a routineundertaking for those of ordinary skill in the art having the benefit ofthis disclosure.

The present subject matter will now be described with reference to theattached figures. Various structures, systems and devices areschematically depicted in the drawings for purposes of explanation onlyand so as to not obscure the present disclosure with details that arewell known to those skilled in the art. Nevertheless, the attacheddrawings are included to describe and explain illustrative examples ofthe present disclosure. The words and phrases used herein should beunderstood and interpreted to have a meaning consistent with theunderstanding of those words and phrases by those skilled in therelevant art. No special definition of a term or phrase, i.e., adefinition that is different from the ordinary and customary meaning asunderstood by those skilled in the art, is intended to be implied byconsistent usage of the term or phrase herein. To the extent that a termor phrase is intended to have a special meaning, i.e., a meaning otherthan that understood by skilled artisans, such a special definition willbe expressly set forth in the specification in a definitional mannerthat directly and unequivocally provides the special definition for theterm or phrase.

Generally, the subject matter disclosed herein provides methods andsemiconductor devices based on a “doublet” configuration in the contactstructure, in which performance of at least one type of transistor maybe enhanced by dividing a highly stressed dielectric material intoseparate layers, each of which may exhibit a substantially conformalconfiguration. For this purpose, after the deposition of the firstconformal stress-inducing material, a buffer material, such as adielectric material as is usually employed as interlayer dielectricmaterial, for instance in the form of silicon dioxide and the like, maybe deposited on the basis of a deposition technique providing enhancedgap-filling capabilities, thereby reducing the overall surfacetopography. In a subsequent deposition step, a further highly stresseddielectric material may be deposited in a substantially conformal manneras may be compatible with the deposition capabilities of the depositionprocess under consideration and the device geometry as created by theprevious deposition of the buffer material. Consequently, during bothdeposition steps for forming the highly stressed dielectric materials, areduced probability for creating any irregularities, such as voids orseams, may be accomplished, thereby contributing to the scalability ofthe doublet configuration, while nevertheless providing an increasedamount of highly stressed dielectric material in the vicinity of thetransistor elements under consideration.

For example, the constraints of a deposition process for forming ahighly tensile stressed silicon nitride material may be respected byappropriately selecting a thickness of the first stressed dielectricmaterial in conformity with the overall device geometry, wherein thesubsequent deposition of the buffer material on the basis of a techniquewith improved gap-filling capabilities may provide a less pronouncedsurface topography or may at least maintain a similar surface topographyas encountered by the first deposition step, thereby enabling thedeposition of a further dielectric material with reduced probability forcreating voids and seams. Hence, a significant performance gain forN-channel transistors may be achieved since the overall amount of highlystressed material in the vicinity of the transistors may be increasedcompared to conventional dual stress liner approaches in which a reducedlayer thickness has to be used unless risking an inappropriate increaseof yield loss due to irregularities, such as voids and seams. Althoughthe doublet configuration may be highly advantageous in view ofenhancing performance of N-channel transistors, the respective techniquemay also be applied to P-channel transistors when requiring acompressive dielectric material. Furthermore, in some illustrativeaspects disclosed herein, a high degree of compatibility withconventional integration schemes for forming an interlayer dielectriclayer stack may be accomplished by providing the buffer material on thebasis of a deposition technique, such as a thermally activated chemicalvapor deposition (CVD) process for forming a silicon dioxide materialusing TEOS, which is a well-established deposition technique.

Consequently, based on the principles disclosed herein, the amount ofstressed material may be increased compared to conventional dual stressliner approaches without substantially sacrificing yield, due to thereduced surface topography obtained by the intermediate buffer material.Hence, the subject matter disclosed herein may be advantageously appliedto highly scaled semiconductor devices including transistor elementshaving a gate length of 50 nm and less.

FIG. 2 a schematically illustrates a semiconductor device 200 comprisinga substrate 201 having formed thereabove a semiconductor layer 202. Thesubstrate 201 may represent any appropriate carrier material for formingthereon the semiconductor layer 202, which may comprise a significantportion of silicon, possibly in combination with other components, suchas germanium, carbon, tin and the like, when, for instance, embeddedstrain-inducing mechanisms are considered. Furthermore, depending on thedevice requirements, the substrate 201, in combination with thesemiconductor layer 202, may form an SOI configuration, wherein a“buried” insulating material is formed below the semiconductor layer202. In other cases, the substrate 201 may represent a substantiallycrystalline semiconductor material, wherein the semiconductor layer 202may represent an upper portion thereof to thereby provide a “bulk”configuration. It should be appreciated, however, that a mixture of anSOI configuration and a bulk configuration may be provided in thesemiconductor device 200, depending on the overall device requirements.

The semiconductor device 200 may further comprise a plurality oftransistor elements 220, which may represent “densely spaced” transistorelements, wherein a distance between neighboring transistor elements iscomparable or even less than the overall transistor dimensions, at leastin one lateral dimension. In the embodiment shown, the transistorelements 220 may comprise a gate electrode structure 221, which may becomprised of an appropriate conductive material, such as polysilicon,possibly in combination with metal silicide, or any other appropriatematerials, which may comprise a more or less amount of metal and thelike. The gate electrode structures 221 may be separated from a channelregion 224 by a gate insulation layer 223, which may comprise anyappropriate material, such as silicon dioxide, silicon oxynitride,high-k dielectric materials and the like. Furthermore, the drain andsource regions 225 may be defined in the semiconductor layer 202 so asto form respective PN junctions with the channel region 224. Moreover,the gate electrode structure 221 may include a spacer structure 222,which may have any appropriate width, depending on the overall processand device requirements. For example, the spacer structure 222 maycomprise materials, such as silicon dioxide and/or silicon nitride andthe like. It should be appreciated that, in other illustrativeembodiments (not shown), the spacer structure 222 may be provided with asignificantly reduced width or may be formed with a substantiallyconformal configuration so as to enable the positioning of highlystressed material more closely to the channel region 224. It should beappreciated that, in the cross-sectional view of FIG. 2 a, thehorizontal lateral dimension corresponds to the transistor lengthdirection. Hence, the gate length of the gate electrode structure 221 issubstantially defined by the horizontal extension of the gate electrode221, which substantially determines a channel length of the channel 224.In sophisticated applications, the length of the gate electrodestructure 221 may be approximately 50 nm and less so that acorresponding lateral distance between adjacent gate electrodestructures including the spacer structures 222 may be 100 nm and evenless in densely packed device regions, in which a plurality of gateelectrode structures may be positioned in parallel.

Consequently, a certain surface topography may be defined by thetransistors 220, above which is formed a highly stressed dielectriclayer 230A, which may be provided in a substantially conformalconfiguration. That is, the highly stressed dielectric layer 230A mayhave substantially uniform layer thickness, irrespective of whether thethickness is to be taken at substantially horizontal portions orsubstantially vertical portions. For example, a thickness 230T of thelayer 230A may be taken at the top of the gate electrodes 221 and thisthickness 230T may be approximately the same at any position in andadjacent to the transistor 220. It should be appreciated that“approximately” in this sense is to be understood as specifying a rangecorresponding to +/−10-15% of the value 230T as determined on top of thegate electrode 221. In some illustrative embodiments, the layer 230A maycomprise a tensile stressed dielectric material having an internalstress level of approximately 1 GPa and higher so as to create a certaintensile force on the transistors 220, thereby finally resulting in arespective strain in the channel regions 224. As previously noted, in astandard crystallographic configuration of a silicon-based semiconductormaterial, a respective tensile strain in the channel region 224 mayresult in an increased electron mobility, thereby obtaining an increasedtransistor performance for N-channel transistors.

The semiconductor device 200 as shown in FIG. 2A may be formed on thebasis of substantially the same process techniques as previouslydescribed with reference to the device 100. That is, the transistors 220may be formed on the basis of well-established techniques in compliancewith the respective design rules, which may result in a specified gatelength and a respective distance between neighboring transistors. Afterhaving completed the transistors 220, the dielectric material 230A maybe deposited on the basis of an appropriate deposition technique, suchas a PECVD process, in which silicon nitride material may be depositedon the basis of well-established recipes. As previously explained,during the deposition of the layer 230A so as to exhibit a high tensilestress, a reduced RF power may result in a reduced surface diffusivityof the reactive components so that only very moderate gap-fillingcapabilities may be obtained. Hence, the thickness 230T is selected suchthat a substantially conformal deposition behavior is obtained, therebysubstantially avoiding the merging of the material of the layer 230Abetween adjacent two of the transistors 220 which may otherwise resultin voids or seams, as previously explained. Thus, for a given set ofprocess parameters, which may be selected to obtain the desired highinternal stress level, the thickness 230T may be selected in accordancewith the design rules such that a substantially conformal depositionbehavior is obtained. For instance, for a distance between adjacenttransistors 220 of approximately 200 nm, the thickness 230T may beselected to be approximately 100 nm or less to reduce the probability ofcreating deposition-related irregularities. For example, the thickness230T may be selected to be approximately 80 nm and less for gateelectrode structures 221 having a length of approximately 50 nm. Forfurther scaled transistor elements, appropriately adapted values for thethickness 230T may be selected, for instance, to approximately 60 nm andless.

FIG. 2 b schematically illustrates the semiconductor device 200 in afurther advanced manufacturing stage. As shown, the semiconductor device200 may further comprise a buffer material 250 that is formed on thestress-inducing layer 230A, wherein the material 250 may reliably fillthe gap between the adjacent transistors 220, thereby providing a“non-conformal” configuration. That is, a thickness 250T maysignificantly vary, depending on the underlying surface topography. Forexample, the value of the thickness 250T above the top face of the gateelectrode 221 may be less than a value between the adjacent transistors220, wherein a difference may be in the range of approximately 30-100%or even more, depending on the material characteristics and thedeposition technique used for forming the buffer material 250.Consequently, the thickness 250T may be referred to as an averagethickness of the material 250, which may represent any appropriaterepresentation of the various thickness values obtained for the material250. In this sense, an “average” thickness of the material 250 may evenbe represented by a value taken at substantially horizontal deviceportions, such as above the top face of the gate electrode 221, whichmay typically represent the smallest thickness value. In someillustrative embodiments, the buffer material 250 may be comprised of asilicon dioxide material to provide a high degree of compatibility withconventional interlayer dielectric stacks, in which silicon dioxideformed of TEOS may frequently be used. In some illustrative embodiments,the average thickness 250T may be greater than the thickness 230T of thepreviously formed layer 230A, thereby providing, in combination with thenon-conformal configuration, a reduced surface topography. For example,the average thickness 250T may range from approximately 100 nm toseveral hundred nm, while in other illustrative embodiments (not shown)the buffer material 250 may be provided with a thickness 250T that iscomparable with the thickness of the layer 230A as long as anon-conformal configuration may be obtained in order to reliably fillthe spaces between the adjacent transistors 220.

The buffer material 250 may be formed on the basis of an appropriatedeposition technique having enhanced gap-filling capabilities comparedto the deposition technique for forming the layer 230A, as previouslyexplained. For instance, in some illustrative embodiments, the buffermaterial 250 may be deposited on the basis of a thermally activated CVDtechnique, such as sub-atmospheric CVD (SACVD), which may enable adeposition of, for instance, silicon dioxide material with enhancedgap-fill capabilities compared to, for instance, PECVD techniques. Forthis purpose, TEOS (tetra ethyl orthosilicate) may be used incombination with a moderately high process pressure of approximately200-700 Torr, thereby obtaining a substantially flow-like depositionbehavior. In other illustrative examples, any other appropriatedeposition technique may be used, as long as process parameters may beselected such that at least the gap between the neighboring transistors220 may be reliably filled to provide a less critical surface topographyfor a subsequent further deposition of a highly stressed dielectricmaterial. For instance, PECVD techniques for depositing silicon dioxidemay be appropriate as long as the gap-filling capabilities are achievedand a high degree of compressive stress may be avoided in the buffermaterial 250, which may otherwise adversely affect the overallstrain-inducing mechanism.

FIG. 2 c schematically illustrates the semiconductor device 200 in amanufacturing stage in which a further stress-inducing dielectricmaterial 230B is formed above the buffer material 250. The layers 230A,230B exhibit the same type of internal stress, for instance, a tensilestress, to increase the amount of tensile stressed dielectric materialthat is positioned in the vicinity of the transistors 220. The layer230B may be provided as a substantially conformal layer to reduce theprobability of creating any deposition-related irregularities, wherein,however, the buffer material 250 may provide appropriate surfaceconditions that may enable the deposition of the material 250T with athickness that is comparable to or greater than the thickness 230T ofthe layer 230A. With respect to a deposition technique for forming thelayer 230B, substantially the same criteria apply as previouslyexplained with reference to the layer 230A.

Thus, the high tensile stress of the layer 230B may act on the buffermaterial 250, thereby creating a respective deformation and straintherein, which may in turn increase the overall tensile stress forcescreated by the initial layer 230A. Consequently, the overall tensileforce acting on the transistors 220 may be increased due to the presenceof the layer 230B, thereby enhancing the performance of the transistors220, while maintaining the probability of creating deposition-relatedirregularities at a low level.

FIG. 2 d schematically illustrates the semiconductor device 200 in afurther advanced manufacturing stage. As shown, a final dielectricmaterial 260 is formed above the stressed layer 230B, wherein, in themanufacturing stage shown, the material 260 may comprise a substantiallyplanar surface topography as is advantageous for the lithography processto be performed for patterning the dielectric layer stack comprised ofthe materials 260, 230B, 250 and 230A. The final dielectric material 260may be formed on the basis of any appropriate deposition technique, forinstance, using CVD techniques for depositing silicon dioxide material,for instance using TEOS as a precursor material, thereby obtaining ahigh degree of compatibility with conventional manufacturing regimes forforming interlayer dielectric stacks. After the deposition of thematerial 260, appropriate planarization processes may be performed, forinstance, using chemical mechanical polishing (CMP), whereinwell-established recipes may be used for silicon dioxide basedmaterials. Thereafter, an etch mask may be defined by photolithography,according to well-established strategies, and a first etch process maybe performed to etch through the final dielectric material 260.

FIG. 2 e schematically illustrates the device 200 during a respectiveetch process 262 on the basis of an etch mask 261 in order to provide anopening 260A in the material 260. The etch process 262 may be performedon the basis of well-established recipes when, for instance, silicondioxide is provided for the final dielectric material 260. During theetch process 262, the layer 230B may act as an efficient etch stopmaterial, thereby providing enhanced controllability of the etch process262.

FIG. 2 f schematically illustrates the semiconductor device 200 in afurther advanced stage of the etch process 262, wherein the opening 260Aextends through the layer 230B. For this purpose, an appropriate etchchemistry may be used to etch through the material of the layer 230B,wherein, in some illustrative embodiments, a respective selectivity tothe buffer material 250 may be employed. In this case, the buffermaterial 250 may act as an etch stop material. In other cases, apronounced selectivity of the etch recipe with respect to the materialsof the layers 230B and 250 may not be required, since the averagethickness 250T provides sufficient process margin so as to not undulyetch through the entire buffer material 250, through the layer 230A andinto device areas of the transistor elements 220. Even if a reducedselectivity or no selectivity at all may be used, a time-controlled etchstep may be performed to reliably stop the etch step within the buffermaterial 250. Thereafter, the etch chemistry may be changed to etchthrough the buffer material 250 while using the layer 230A as anefficient etch stop material. For example, well-established selectiveetch recipes for silicon dioxide and silicon nitride may be used, if thebuffer material 250 is provided in the form of silicon dioxide material.In other illustrative embodiments, the etch process 262 as shown in FIG.2 e may be performed as a substantially non-selective etch process withrespect to the materials of the layers 260 and 230B, wherein the etchprocess may be stopped within the buffer material 250 on the basis of atime-controlled etch step. Thereafter, the etch chemistry may be changedto provide an appropriated degree of selectivity with respect to thematerials 250 and 230A. When performing the initial step of the etchprocess 262 as a substantially non-selective etch process, the overallprocess complexity of the patterning sequence may be reduced and may becomparable to conventional strategies.

FIG. 2 g schematically illustrates the semiconductor device 200 in astage in which the opening 260A extends to the layer 230A, which may beaccomplished on the basis of a highly selective etch process.Thereafter, the further processing may be continued on the basis ofwell-established techniques, i.e., the layer 230A may be opened suchthat the contact opening 260A connects to the transistor elements 220.Thereafter, the respective contact opening may be filled with anappropriate material, such as tungsten and the like, whereinwell-established deposition techniques may be used.

It should be appreciated that in the embodiments described above withreference to FIGS. 2 a-2 g, the transistors 220 may represent transistorelements, which require tensile strain for enhancing the performancethereof. Furthermore, in this case, the doublet configuration providedby the layers 230A, 230B and the intermediate buffer material 250 may behighly advantageous in this case due to the significantly restrictedgap-filling capabilities of a tensile stressed silicon nitride. In othercases, the transistors 220 may represent transistor elements requiring acompressively stressed dielectric material and also in this case thedoublet configuration may be formed on the basis of a compressivematerial.

With reference to FIGS. 3 a-3 b, further illustrative embodiments willnow be described in which the doublet configuration is applied todifferent types of transistors, requiring different types of internalstress, wherein at least one type of transistor, for instance, N-channeltransistors, may obtain an increased amount of tensile stresseddielectric material, while a negative influence thereof on the othertype of transistor may be overcompensated for by a respectivecompressively stressed dielectric material.

FIG. 3 a schematically illustrates a semiconductor device 300 comprisinga plurality of transistors 320A, which may represent N-channeltransistors, and one or more transistors 320B, which may represent aP-channel transistor. The transistors 320A, 320B, except for theconductivity type, may have substantially the same configuration aspreviously described with reference to the devices 100 and 200. Hence,any respective components of the transistors 320A, 320B are denoted bythe same reference signs, except for a “3” instead of a “2” or “1” asthe first digit, and any further description of these components will beomitted. The same holds true for the substrate 301 and the semiconductorlayer 302 of the semiconductor device 300.

Moreover, in the manufacturing stage shown, a stress-inducing layer330A, in the embodiment shown, a tensile stressed dielectric material,may be formed above the transistors 320A, wherein, if required, an etchstop layer 331, for instance comprised of silicon dioxide, may be formedon the transistors 320A and optionally on the transistor 320B. Withrespect to the layer 330A, the same criteria apply as previouslyexplained for the layer 230A. Thus, a substantially conformalconfiguration is obtained, thereby reducing the probability of creatingdeposition-related irregularities, in particular between the closelyspaced transistors 320A. Furthermore, an etch stop or etch control layer332 may be formed on the layer 330A followed by a stress-inducing layer340, which may exhibit a different type of internal stress compared tothe layer 330A. That is, in the embodiment shown, the material of layer340 may have a high internal compressive stress. The layer 340 is alsoformed above the transistor 320B so as to induce a desired type ofstrain in the respective channel region 324.

The semiconductor device 300 may be formed on the basis of the followingprocesses. After forming the transistors 320A, 320B on the basis ofwell-established techniques, the etch stop layer 331, if required, maybe formed by well-established conformal deposition techniques, followedby the deposition of the layer 330A on the basis of similar processstrategies as previously described with reference to the layer 230A.Thereafter, the etch stop or etch control layer 332 may be formed, forinstance, in the form of silicon dioxide, followed by the deposition ofthe layer 340, which may be accomplished on the basis of less criticalprocess parameters in view of gap-filling capabilities, since therespective RF power and thus surface diffusivity may be increasedcompared to the deposition of the layer 330A. Furthermore, the layer330A may be provided in a highly conformal state, as previouslyexplained, since a further tensile stressed material may be deposited ina later manufacturing stage, thereby also providing appropriate surfaceconditions for the deposition of the layer 340. Thereafter, anappropriate etch mask may be formed to cover the transistor 320B andexpose the transistors 320A to an appropriately designed etch ambientfor removing the exposed portion of the layer 340, wherein therespective etch process may be controlled on the basis of the etch stopor etch control layer 332.

FIG. 3 b schematically illustrates the semiconductor device 300 in afurther advanced manufacturing stage. As shown, a buffer material 350 isformed above the transistors 320A, 320B followed by a further tensilestressed dielectric layer 330B so as to increase the overall amount oftensile stressed material above the transistors 320A. As previouslyexplained, the buffer material 350 may provide enhanced surfaceconditions for the further deposition of the material 330B with reducedprobability for creating deposition-related irregularities. On the otherhand, the buffer material 350 may reduce the efficiency of the stress ofthe layer 330B on the layer 340, thereby substantially not undulyaffecting the overall performance of the transistor 320B. That is,typically, a compressively stressed silicon nitride material ornitrogen-containing silicon carbide material may be provided with asignificantly higher internal stress level compared to a tensilestressed silicon nitride material, thereby resulting in an efficientstrain-inducing mechanism. Moreover, as previously explained, the layer340 may additionally be provided with increased thickness compared tothe layer 330A, due to the less critical deposition parameters, whichmay also result in a highly efficient creation of compressive forcesacting on the transistor 320B. Thus, the doublet structure above thetransistors 320A, 320B may efficiently enhance the performance of thetransistors 320A, while not unduly compromising the gain in performanceobtained by the layer 340 in the transistor 320B.

With reference to FIGS. 4 a-4 b, further illustrative embodiments willnow be described in which buffer materials may be used during variousmanufacturing stages.

FIG. 4 a schematically illustrates a semiconductor device 400 comprisinga plurality of transistors 420A and 420B, which may have substantiallythe same configuration as previously described. The transistors 420A,420B may be formed above a substrate 401 comprising a semiconductorlayer 402. For the components described so far, the same criteria applyas previously explained. Furthermore, the components of the transistors420A, 420B may be denoted by the same reference signs as in thepreviously described embodiments except for a “4” as the first digit.Hence, any detailed description thereof will be omitted. In themanufacturing stage shown, a stress-inducing layer 440 may be formedabove the transistor 420B followed by a first buffer material 450B,which may comprise any appropriate material, such as silicon dioxide.Furthermore, a stress-inducing layer 430A is formed above thetransistors 420A and on the buffer layer 450B. As shown, the layers430A, 440 may be provided in a substantially conformal configuration, aspreviously explained. That is, the layer 440 may be formed with anappropriate deposition technique followed by the deposition of thebuffer layer 450B, which may be provided with any appropriate thicknessso as to relax the surface topography created by the deposition of thelayer 440. In some illustrative embodiments, a thickness of the bufferlayer 450B may be comparable or even less than the thickness of thelayer 440, while nevertheless providing enhanced gap-fillingcapabilities so as to reliably fill the gaps between adjacenttransistors. For this purpose, any appropriate deposition technique,such as a thermally activated CVD process, may be used, as previouslydescribed. Next, the layer 440 and the buffer material 450B may beremoved from above the transistors 420A by appropriately designedmasking and etch techniques. Next, the layer 430A is deposited so as toobtain a highly conformal deposition behavior, as previously explained.It should be appreciated that, due to the provision of the buffer layer450B, a substantially void-free and seamless deposition of the layer430A may also be accomplished above the transistors 420B, therebyenhancing the process conditions during a subsequent etch processperformed on the basis of an etch mask 403 to remove the layer 430A fromabove the transistors 420B. Thus, during the etch process 404, thematerial of the layer 430A may be reliably removed, wherein the process404 may be controlled on the basis of the buffer material 450B. Hence,exposure of the layer 440 to the ambient of the etch process 404 may beavoided, since the buffer material 450B, now acting as an etch stopmaterial, may be provided with sufficient thickness of approximately30-80 nm, for example, so that even a significant amount of the buffermaterial 450B may be maintained after the etch process 404.

FIG. 4 b schematically illustrates the semiconductor device 400 infurther advanced manufacturing stage, in which a further buffer material450A is formed above the transistors 420A, 420B followed by a furtherstress-inducing layer 430B having the same internal type of stress asthe layer 430A so as to enhance performance of the transistors 420A. Onthe other hand, in addition to enhancing the overall process efficiencyduring the deposition of the layer 430A and removal thereof above thetransistor 420B, the remaining buffer material 450B in combination withthe buffer material 450A may provide an increased distance of layer 430Awith respect to the stress-inducing layer 440. Hence, any negativeimpact on the transistors 420B caused by the presence of the layer 430Amay further be reduced. The increased thickness of the buffer materialprovided above the transistors 420B compared to the transistor 420A maynot substantially negatively influence the further processing of thedevice 400, since, for instance, after the deposition of a finaldielectric material and the patterning thereof, using, for instance, thelayer 430B as an efficient etch stop material, the selectivity betweenthe buffer materials 450A, 450B and the layers 440 and 430A maynevertheless provide sufficient process uniformity, since the additionalthickness of the layer 450B may not result in undue material removal ofthe layer 430A.

As a result, the subject matter disclosed herein provides techniques andsemiconductor devices in which performance of at least one type oftransistor may be significantly enhanced by increasing the amount ofstressed dielectric material, while not contributing todeposition-related irregularities, such as voids and seams. For thispurpose, the deposition of a stressed dielectric material may be “split”into two parts with an intermediate buffer material formed on the basisof a technique having enhanced gap-filling capabilities. For example,the critical deposition of tensile stressed dielectric material may beperformed in two steps with an intermediate deposition step forproviding an appropriate buffer material, for instance, silicon dioxide,to provide a doublet structure in the corresponding interlayerdielectric layer stack. Furthermore, the doublet configuration for onetype of transistor elements may be advantageously used in combinationwith different transistor types, wherein the doublet structure may notunduly affect performance of the other type of transistor requiring adifferent type of stress compared to the type of stress provided by thedoublet configuration. In this case, in some illustrative embodiments,even an enhanced overall deposition and patterning regime may beobtained on the basis of the doublet configuration.

The particular embodiments disclosed above are illustrative only, as theinvention may be modified and practiced in different but equivalentmanners apparent to those skilled in the art having the benefit of theteachings herein. For example, the process steps set forth above may beperformed in a different order. Furthermore, no limitations are intendedto the details of construction or design herein shown, other than asdescribed in the claims below. It is therefore evident that theparticular embodiments disclosed above may be altered or modified andall such variations are considered within the scope and spirit of theinvention. Accordingly, the protection sought herein is as set forth inthe claims below.

1-25. (canceled)
 26. A method, comprising: conformally forming a firststress-inducing layer above a first transistor and a second transistorformed above a substrate, said first stress-inducing layer generating afirst type of stress; forming a first dielectric layer above said firststress-inducing layer, said first dielectric layer having an internalstress level less than a stress level of said first stress-inducinglayer; selectively removing said first stress-inducing layer and saidfirst dielectric layer from above said first transistor, a portion ofsaid first dielectric layer remaining above said second transistor;forming a second stress-inducing layer above said first transistor andsaid portion of said first dielectric layer, said second stress-inducinglayer inducing a second type of stress different from said first type ofstress; selectively removing said second stress-inducing layer fromabove said second transistor using said portion of said first dielectriclayer as an etch stop material; forming a second dielectric layer abovesaid second stress-inducing layer and said portion of said firstdielectric layer; and forming an interlayer dielectric layer above saidsecond dielectric layer.
 27. The method of claim 26, further comprisingforming a third stress-inducing layer above said second dielectric layerprior to forming said interlayer dielectric layer, said thirdstress-inducing layer inducing said second type of stress.
 28. Themethod of claim 26, further comprising forming a contact opening in saidinterlayer dielectric layer.
 29. The method of claim 26, wherein saidfirst type of stress is a tensile stress.
 30. The method of claim 26,wherein said first dielectric layer is deposited so as to reduce heightdifferences in a surface topography generated by said firststress-inducing layer.
 31. The method of claim 30, wherein said firstdielectric layer is deposited with an average layer thickness that isgreater than the thickness of said first stress-inducing layer.
 32. Themethod of claim 31, wherein said second dielectric layer is depositedwith an average thickness that is greater than said average thickness ofsaid first dielectric layer.
 33. The method of claim 26, furthercomprising forming a contact opening extending through said interlayerdielectric layer and said first and second dielectric layers, whereinsaid first and second stress-inducing layers act as etch stop layerswhen sequentially etching said first and second dielectric layers. 34.The method of claim 26, wherein said first and second stress-inducinglayers comprise silicon nitride.
 35. The method of claim 26, whereinsaid first and second dielectric layers are comprised of the samematerial.
 36. A method, comprising: forming a first stress-inducingdielectric layer above a first transistor in a conformal manner by usinga first deposition technique, said first stress-inducing layer inducinga first type of stress; forming a first buffer layer above said firststress-inducing layer by using a second deposition technique having anincreased gap-filling capability compared to said first depositiontechnique; selectively removing said first stress-inducing layer andsaid first buffer layer from above said first transistor, a portion ofsaid first buffer layer remaining above said second transistor; forminga second stress-inducing layer above said first transistor and saidportion of said first buffer layer, said second stress-inducing layerinducing a second type of stress different from said first type ofstress; selectively removing said second stress-inducing layer fromabove said second transistor using said portion of said first bufferlayer as an etch stop material; forming a second buffer layer above saidsecond stress-inducing layer and said portion of said first bufferlayer; and forming an interlayer dielectric layer above said secondbuffer layer.
 37. The method of claim 36, wherein said first depositiontechnique comprises a plasma enhanced deposition process.
 38. The methodof claim 37, wherein said second deposition technique comprises athermally activated chemical vapor deposition process.
 39. The method ofclaim 37, wherein said first stress-inducing dielectric layer is atensile stressed layer.
 40. The method of claim 37, wherein a thicknessof said first stress-inducing dielectric layer is less than an averagethickness of said first buffer layer.
 41. The method of claim 37,further comprising forming a third stress-inducing layer above saidsecond buffer layer prior to forming said interlayer dielectric layer,said third stress-inducing layer inducing said second type of stress.42. A semiconductor device, comprising: an interlayer dielectric layerstack formed above a plurality of transistors, said interlayerdielectric layer stack comprising: a first stress-inducing layer locatedabove a first transistor, said first stress-inducing layer inducing afirst type of stress; a first buffer material formed above said firststress-inducing layer; a second stress-inducing layer formed above asecond transistor, said second stress-inducing layers inducing a secondtype of stress different than said first type; a second buffer materialformed above said first and second and second transistors; a thirdstress inducing layer formed above said second buffer material, saidthird stress-inducing layer inducing said second type of stress; and aninterlayer dielectric material formed above said second buffer material.43. The semiconductor device of claim 42, wherein said firststress-inducing layer has a substantially uniform thickness that is lessthan an average thickness of said buffer material.
 44. The semiconductordevice of claim 42, wherein a thickness of said second stress-inducinglayer is less than said average thickness of said buffer material. 43.The semiconductor device of claim 42, wherein an average thickness ofsaid final dielectric material is greater than an average thickness ofsaid buffer material.
 44. The semiconductor device of claim 42, whereinsaid first type of stress comprises tensile stress.